URF series (Glass/PCB/FPC)
White Reflective Solder Resist Ink
White Reflective Solder Resist Ink
Addresses problems with conventional reflective sheet punching and processing yields
UV curing type
Replacement for backlight module reflectors
Adhesion ≥ 4B (@Glass/Cu foil/FR4)
High reflectivity: Reflectivity ≥ 90% (@25 μm)
IR-reflow resistance: b*<3 (@250°Cx10 min)
High weather resistance: Low change in reflectivity, no yellowing
UV curing type
Replacement for backlight module reflectors
Adhesion ≥ 4B (@Glass/Cu foil/FR4)
High reflectivity: Reflectivity ≥ 90% (@25 μm)
IR-reflow resistance: b*<3 (@250°Cx10 min)
High weather resistance: Low change in reflectivity, no yellowing
UBM series
Matte Black Matrix Resist
Matte Black Matrix Resist
High opacity and insulating properties
UV curing type
Suitable for piezoelectric printing
Glass adhesion ≥ 4B
Insulation properties: Surface resistance ≥ 1013 Ω/□
High opacity: OD ≥ 3 (@100μm)
Low surface gloss
UV curing type
Suitable for piezoelectric printing
Glass adhesion ≥ 4B
Insulation properties: Surface resistance ≥ 1013 Ω/□
High opacity: OD ≥ 3 (@100μm)
Low surface gloss
